| 1. | Development of cpu chip package technology
芯片封装技术的发展演变 |
| 2. | The development of cpu chip package technology
芯片封装技术的发展 |
| 3. | Registers on a given cpu chip that store very low - level information
给定cpu芯片上存储非常低级别信息的寄存器。 |
| 4. | This paper presents the logic circuit design of ccu for lx - 1164 cpu chip , for ccu , data and instructions are stored in separate data and instruction caches
本人有幸在夏宏博士的指导下参加这一工程，承担lx ? 1164cpu的高速缓存控制器( ccu )的逻辑设计和功能仿真。 |
| 5. | I guess the most notable thing is putting the memory controller on the cpu chip , which has already been done by the alpha people , and has already been shown to have upsides and downsides
我想最值得注意的就是将存储器控制器放到cpu芯片上，这一点开发alpha的人员已经使用了，而且已经表现出有利也有弊。 |
| 6. | The higher the processing speed of computer , the more heat generating from cpu chip . if the heat ca n ' t be dissipatied effectively , the processing stability and speed will be decreased dramatically
计算机运行速度越高其芯片cpu发热量越大，如果这些热量得不到有效散逸，会制约芯片速度的进一步提高。 |
| 7. | In order to fit the demand for future high speed cpu chip whose running heat flux reaches to 100 - 1000w / cm2 , the development of an efficient cooling technology has become the update key projects all over the world
针对热流密度高达100 ? 1000w / cm2的高速cpu芯片，开发有效的冷却技术，是当今世界正在研究的重要课题。 |
| 8. | Dsp products used primarily multi - cpu chips and parallel processing technology , to develop a series of products has been widely used for electricity , communications , transportation , national defense and generating new energy fields
主要产品采用dsp芯片及多cpu并行处理技术，开发出的系列产品已广泛应用于电力、通信、交通、国防及新能源发电等领域。 |
| 9. | But when the wind - speed becomes above 1m / s hereafter , wind - speed increase for the cpu thermal siphon of transmit heat the ability ' s gain result the deceleration . so it is considered perfect when the wind - speed is 1m / s . through this experimentation we found that when the cpu thermal syphon cooling machine used acetone as working fluid , wind - speed 1m / s , cpu chip caloricty 60w , its volumetric heat release rate came to 1 . 3 104w / ( m3k )
通过本次实验测出所使用的cpu重力热管散热器在使用丙酮为工质，风速1m / s ， cpu芯片发热量为60w时，其体积散热率达到1 . 3 104w / ( m3k ) ,能保证芯片温度与环境温度之差小于40 ，能很好的适应pentium -计算机长期运行的要求。 |
